Design, Characterization, and Packaging for MEMS and Microelectronics

Design, Characterization, and Packaging for MEMS and Microelectronics

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The thick metal is used primarily for the construction of low-loss signal conduction paths, such as coplanar waveguides. ... Simulation of the various device topologies and sizes were performed using Ansofta#39;s HFSS. [22] By utilizing the batch mode capabilities of this software, numerous simulations were performed with minimal user input after simulation ... [7-15, 20] Due to the large number of experiments that are planned, the drive mechanisms for the rotating devices must be designedanbsp;...


Title:Design, Characterization, and Packaging for MEMS and Microelectronics
Author: Paul D. Franzon, United States. Air Force. Asian Office of Aerospace Research and Development, Institute of Electrical and Electronics Engineers. South Australia Section
Publisher:Society of Photo Optical - 2001
ISBN-13:

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